Micro and Nanoelectromechanical Systems
Temperature cycling refers to the process of subjecting a material or device to alternating high and low temperatures over a specific period. This testing method is crucial for assessing the reliability and performance of MEMS/NEMS devices, as it simulates real-world conditions that these devices may encounter during their lifespan. Understanding how materials respond to thermal stress helps identify potential failure mechanisms and ensures the durability of micro and nano-scale systems.
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