🔌Intro to Electrical Engineering Unit 9 – Semiconductor Basics in Electrical Engineering

Semiconductors are materials with unique electrical properties that bridge the gap between conductors and insulators. They form the foundation of modern electronics, enabling the creation of transistors, diodes, and integrated circuits that power our digital world. This unit explores the atomic structure, band theory, and doping of semiconductors. It covers pn junctions, diodes, and various semiconductor applications in electronics, from smartphones to renewable energy systems, highlighting their crucial role in technology.

What Are Semiconductors?

  • Materials with electrical conductivity between conductors (metals) and insulators (ceramics)
  • Conductivity can be controlled by doping, temperature, and applied electrical fields
  • Most commonly used semiconductors are silicon (Si) and germanium (Ge)
  • Semiconductors form the basis for modern electronics (transistors, diodes, integrated circuits)
  • Unique properties arise from their atomic structure and energy band configuration
    • Valence band and conduction band separated by a small energy gap
    • Electrons can be excited from valence to conduction band, creating mobile charge carriers
  • Intrinsic semiconductors are pure materials with equal numbers of electrons and holes
  • Extrinsic semiconductors are doped with impurities to create excess electrons (n-type) or holes (p-type)

Atomic Structure and Band Theory

  • Semiconductors have a crystal lattice structure with covalent bonding between atoms
  • Energy bands form due to the periodic potential of the lattice and wave-particle duality of electrons
  • Valence band is the highest occupied energy band at absolute zero temperature
  • Conduction band is the lowest unoccupied energy band, separated from valence band by an energy gap (EgE_g)
  • Fermi level (EFE_F) represents the energy level with a 50% probability of being occupied by an electron
    • In intrinsic semiconductors, EFE_F lies near the middle of the bandgap
    • In n-type semiconductors, EFE_F is closer to the conduction band
    • In p-type semiconductors, EFE_F is closer to the valence band
  • Electrons can be excited from valence to conduction band by absorbing energy greater than EgE_g
  • Holes are created in the valence band when electrons are excited, acting as positive charge carriers

Types of Semiconductors

  • Elemental semiconductors consist of a single element (Si, Ge)
  • Compound semiconductors are formed by combining elements from groups III and V (GaAs, InP) or II and VI (CdTe, ZnO)
    • Offer unique properties such as direct bandgap, high mobility, and optoelectronic capabilities
  • Organic semiconductors are carbon-based materials (polymers, small molecules) with semiconducting properties
  • Wide bandgap semiconductors have EgE_g greater than 2 eV (SiC, GaN, diamond)
    • Suitable for high-power, high-temperature, and high-frequency applications
  • Narrow bandgap semiconductors have EgE_g less than 1 eV (InSb, HgCdTe)
    • Used in infrared detectors and low-energy photonic devices
  • Amorphous semiconductors lack long-range atomic order (a-Si:H)
    • Used in thin-film transistors and solar cells

Doping and Carrier Concentration

  • Doping is the intentional introduction of impurities into a semiconductor to control its electrical properties
  • n-type doping involves adding group V elements (donors) to create excess electrons in the conduction band
    • Donors occupy energy levels near the conduction band, easily ionized at room temperature
    • Examples: phosphorus (P), arsenic (As), and antimony (Sb) in silicon
  • p-type doping involves adding group III elements (acceptors) to create excess holes in the valence band
    • Acceptors occupy energy levels near the valence band, easily accepting electrons from the valence band
    • Examples: boron (B), aluminum (Al), and gallium (Ga) in silicon
  • Carrier concentration (nn for electrons, pp for holes) depends on doping levels and temperature
    • In intrinsic semiconductors, n=p=nin = p = n_i, where nin_i is the intrinsic carrier concentration
    • In n-type semiconductors, npn \gg p, and nNDn \approx N_D, where NDN_D is the donor concentration
    • In p-type semiconductors, pnp \gg n, and pNAp \approx N_A, where NAN_A is the acceptor concentration
  • Law of mass action: np=ni2np = n_i^2, holds for both intrinsic and extrinsic semiconductors at equilibrium

PN Junctions and Diodes

  • A pn junction is formed when a p-type semiconductor is joined with an n-type semiconductor
  • Diffusion of carriers across the junction creates a depletion region with a built-in electric field
    • Electrons diffuse from n-type to p-type, leaving behind positively charged donor ions
    • Holes diffuse from p-type to n-type, leaving behind negatively charged acceptor ions
  • The built-in electric field opposes further diffusion, resulting in an equilibrium state
  • Applying a forward bias (positive voltage to p-type, negative to n-type) reduces the depletion region and allows current to flow
  • Applying a reverse bias increases the depletion region and allows only a small leakage current to flow
  • The current-voltage (I-V) characteristic of a pn junction is described by the Shockley diode equation:
    • I=Is(eqV/nkT1)I = I_s(e^{qV/nkT} - 1), where IsI_s is the reverse saturation current, qq is the electron charge, VV is the applied voltage, nn is the ideality factor, kk is Boltzmann's constant, and TT is the absolute temperature
  • Diodes are two-terminal devices that allow current to flow in one direction (forward-biased) and block current in the other (reverse-biased)
    • Rectifier diodes convert AC to DC
    • Zener diodes maintain a constant voltage when reverse-biased beyond a specific voltage
    • Light-emitting diodes (LEDs) emit light when forward-biased
    • Photodiodes generate current when exposed to light

Semiconductor Applications in Electronics

  • Transistors are three-terminal devices that amplify or switch electronic signals
    • Bipolar junction transistors (BJTs) use both electrons and holes as charge carriers
    • Field-effect transistors (FETs) use an electric field to control the conductivity of a channel
      • Metal-oxide-semiconductor FETs (MOSFETs) are the most common type, used in integrated circuits
  • Integrated circuits (ICs) are miniaturized electronic circuits fabricated on a single semiconductor substrate
    • Contain thousands to billions of transistors, diodes, resistors, and capacitors
    • Enable complex digital and analog functions (microprocessors, memory, amplifiers, sensors)
  • Optoelectronic devices convert between electrical and optical signals
    • LEDs and laser diodes generate light from electrical current
    • Photodiodes and solar cells convert light into electrical current
    • Optocouplers provide electrical isolation between input and output signals
  • Power electronic devices control and convert electrical power
    • Power diodes and thyristors are used in rectifiers and inverters
    • Insulated-gate bipolar transistors (IGBTs) and power MOSFETs are used in high-efficiency switching applications
  • Sensors and actuators interface with the physical world
    • Temperature sensors (thermistors, thermocouples) change resistance or generate voltage with temperature
    • Pressure sensors (piezoresistive, capacitive) convert pressure into electrical signals
    • Accelerometers and gyroscopes measure acceleration and angular velocity using MEMS technology

Key Equations and Calculations

  • Carrier concentration in intrinsic semiconductors: ni=NcNveEg/2kTn_i = \sqrt{N_c N_v} e^{-E_g/2kT}
    • NcN_c and NvN_v are the effective densities of states in the conduction and valence bands, respectively
  • Fermi level in intrinsic semiconductors: EF=Ec+Ev2+kT2ln(NvNc)E_F = \frac{E_c + E_v}{2} + \frac{kT}{2} \ln(\frac{N_v}{N_c})
    • EcE_c and EvE_v are the conduction and valence band edges, respectively
  • Carrier concentrations in extrinsic semiconductors (assuming complete ionization):
    • n-type: nNDn \approx N_D, pni2NDp \approx \frac{n_i^2}{N_D}
    • p-type: pNAp \approx N_A, nni2NAn \approx \frac{n_i^2}{N_A}
  • Built-in potential of a pn junction: Vbi=kTqln(NANDni2)V_{bi} = \frac{kT}{q} \ln(\frac{N_A N_D}{n_i^2})
  • Depletion region width of a pn junction: W=2ε(VbiVa)q(1NA+1ND)W = \sqrt{\frac{2\varepsilon(V_{bi} - V_a)}{q}(\frac{1}{N_A} + \frac{1}{N_D})}
    • ε\varepsilon is the permittivity of the semiconductor, and VaV_a is the applied voltage
  • Shockley diode equation: I=Is(eqV/nkT1)I = I_s(e^{qV/nkT} - 1)
  • Transistor current gain (BJT): β=IcIb\beta = \frac{I_c}{I_b}, where IcI_c is the collector current and IbI_b is the base current
  • Transistor transconductance (FET): gm=IdVgsg_m = \frac{\partial I_d}{\partial V_{gs}}, where IdI_d is the drain current and VgsV_{gs} is the gate-source voltage

Real-World Examples and Industry Uses

  • Smartphones and tablets rely on advanced semiconductor technology
    • High-performance processors (Apple A-series, Qualcomm Snapdragon) built using billions of transistors
    • OLED and LCD displays use thin-film transistors (TFTs) to control individual pixels
    • CMOS image sensors capture high-resolution photos and videos
    • Flash memory (NAND) provides high-density storage for apps, media, and data
  • Renewable energy systems heavily utilize power electronics
    • Solar inverters convert DC power from photovoltaic panels to AC power for the grid
    • Wind turbines use power converters to control generator speed and optimize power output
    • High-voltage DC (HVDC) transmission systems use thyristors and IGBTs for efficient long-distance power transmission
  • Automotive industry is increasingly adopting semiconductor technology
    • Electric vehicles (EVs) rely on power electronics for motor control and battery management
    • Advanced driver assistance systems (ADAS) use cameras, radar, and sensors to enhance safety
    • Infotainment systems provide navigation, entertainment, and connectivity features
  • Medical devices and healthcare applications benefit from semiconductor advancements
    • Wearable devices (smartwatches, fitness trackers) monitor vital signs and activity levels
    • Implantable devices (pacemakers, cochlear implants) use miniaturized electronics to improve patient outcomes
    • Medical imaging systems (X-ray, CT, MRI) rely on high-performance sensors and signal processing
  • Aerospace and defense sectors require specialized semiconductor solutions
    • Satellites use solar cells and radiation-hardened electronics to operate in harsh space environments
    • Radar and communication systems employ high-frequency and high-power semiconductor devices (GaN, SiC)
    • Night vision and thermal imaging devices use infrared sensors (HgCdTe, InSb) to detect heat signatures


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AP® and SAT® are trademarks registered by the College Board, which is not affiliated with, and does not endorse this website.